The Open Forum programme for Advanced Engineering 2019 is currently being planned with new topics & speakers updated during the coming weeks.
Forums will provide attendees with insights from leading OEMs and top tier manufacturers demonstrating opportunities in the supply chain, lessons learned from case studies of the latest innovations and technologies in action, and key issues including skills, regulations, market forecasts, and much more.
There is still time to submit your paper - submit yours now before May 31
Open Forums - including just some of our planned coverage:
Medical Device Engineering NEW in 2019
(including: Smart Medical Devices; Wearable Tech; 3D Printing; Cybersecurity; Manufacturing at Point of Need...)
(including: Cutting Through the Hype of I4.0; Big Data; Data Usage; High Volume Manufacturing...)
(including: Aerospace 4.0, Hybrid Propulsion Systems, Additive Manufacturing Applications...)
(including: Future of the Industry; Next Generation Materials; NDE and Repair, Fire Performance...)
(including: Electrification and Hybrid, Autonomy, Lightweighting, Sustainable Manufacturing, Additive Manufacturing...)