The future of packaging technology, materials & services

Visit the Nordic Region's largest packaging trade show in 2013!

PACK & EMBALLAGE Stockholm 2013 is a trade show bursting with ideas on how to improve, streamline and develop your packaging & production processes and to make your products jump off the shelves into customers' shopping carts! It's the place to find cost-effective, innovative packaging and manufacturing solutions.

At PACK & EMBALLAGE Stockholm 2013, you get an exclusive preview of tomorrow's solutions: smarter package labelling, better compatibility with the environment, more efficient machinery and designs that sell. Simply put, the show is a unique forum packed with business opportunities and world-class packaging visions.

At the show you can identify new suppliers, network with fellow professionals and get ideas and inspiration at the show's content-rich learnShops programme.

Welcome!

Robert Monaghan (UK), Renowned packaging design specialist and a well-known speaker – What Sells Best
Read more>>

Rowland Heming (Belgien) Co-founder of Europe’s only Package Design Association PDA-Europe
Read more>>

Place & Opening
Kistamässan, Stockholm 16-17 october 2013
Wednesday 9-17
Thursday 9-16

NEWS
This year we  will have a whole new area for packaging logistik.

Get the latest packaging news today!
read more>>

Search products

20/05 - 2013
Canadian food manufacturer Lassonde Specialties is making the move to carton packs for the company’s ‘Canton’ brand fondue bouillons.
20/05 - 2013
Dr. Niaz Latif, professor and head of the Department of Industrial Technology at Purdue Calumet University, was among those who attended The Automation Conference. He talks with Packaging World’s Pat Reynolds about a stimulating presentation by Arnav Anand of The Center for Entrepreneurship & Technology at UC Berkeley.
20/05 - 2013
Results of survey of breakthrough packaging technologies from the last 25 years name reclosable and microwavable packaging as the innovations that have had the greatest impact.
20/05 - 2013
Just because something can be converted into packaging doesn’t mean that it should be.
20/05 - 2013
Available in four sensing modes, the R2 Series Ultra-Small Sensors from Pepperl+Fuchs feature a 24 mm x 7.5 mm x 11.2 mm housing, industry standard mounting footprint, a flush and wear-resistant antistatic glass lens and a 45° cable outlet to maximize mounting flexibility.

Saloni co-organizzati

Cerca salone